Xinzhizao Motherboard Layered Test Fixture for iPhone X-17 Pro Max

Xinzhizao Motherboard Layered Test Fixture for iPhone X-17 Pro MaxXINZHIZAO motherboard layered test stand repair metal detection fixture for iPhone X 17 series. XINZHIZAO 4 IN 1 double sided motherboard layered test fixture for testing iPhone 14 series motherbord functions. XINZHIZAO XZZ 4 In 1 ISocket motherboard layered test fixture for iPhone14 14Plus 14Pro 14Promax upper lower middle frame test. XINZHIZAO XZZ iPhone 16 series 4 in 1 motherboard layered test fixture for iPhone 16 16 Plus 16 Pro 16 Pro Max

XINZHIZAO motherboard layered test stand repair metal detection fixture for iPhone X-17 series. XINZHIZAO 4 IN 1 double-sided motherboard layered test fixture for testing iPhone 14 series motherbord functions. XINZHIZAO XZZ 4 In 1 ISocket motherboard layered test fixture for iPhone14 /14Plus/14Pro/14Promax upper/lower middle frame test. XINZHIZAO XZZ iPhone 16 series 4-in-1 motherboard layered test fixture for iPhone 16/16 Plus/16 Pro/16 Pro Max motherboard double layer function detection and repair. 

Features:
1. Xinzhizao 14 Series 4-in-1 Motherboard Layered Test Fixture for iPhone 14 / 14Plus / 14 Pro / 14Pro Max.
2. Using a high-quality beryllium copper spring probe.
3. Easy to use, connect the upper and lower layer of the iPhone 14 series motherboard for fast testing.
4. No need to place spacers, and the RF main board, pin board, and logic main board are laminated and stacked on the test frame base in turn.
5. The double-headed probe accurately aligns the small holes to improve the contact performance, the fixed buckle is buckled, the motherboard does not warp, and the test data is more accurate.

XZZ iPhone 16 delamination test frame Features:
1. XZZ iPhone 16 series layered test stand 4in1 is compatible with four models of iPhone 16/16Plus/16Pro/16 Pro Max.
2. The layered test stand has 6 features, using high-density metal, four-in-one, unobstructed, integrated, ergonomic design, and can be accurately positioned.
3. It solves the problem of repeated lamination and delamination during motherboard repair. The frame is equipped with imported pure copper gold-plated spring probes to enhance conductivity and stability, suitable for precise testing before installation.
4. The spring rebounds quickly, the feedback is timely, and the motherboard does not warp. The non-slip foot pad k can prevent sliding due to external forces and other problems during the test.
5. Use of high temperature resistant and corrosion-resistant new materials can not only reduce the return rate, but also improve the repair efficiency.
6. The functional board design is compatible with the test without the middle frame. Avoid the failure of the middle frame during the repair process.

Product Information:
Name: XZZ iPhone 16 delamination test frame.
Probe Type: Custom gold-plated spring probes.
Product Size: 128X68X18mm.
Package Size: 146X95X23mm.
N.W: 189G.
G.W: 249G.
Support Model: iPhone 16/ 16Plus/16Pro/16 Pro Max.