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Shipping Estimate
USA
- USA
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- USA
- CAN
Ships within 48 hours · Estimated delivery Aug 6 - Aug 11
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Description
YCS-H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi-function Glue Removal BGA Soldering Adjustable PCB ClampiProGadgets Repair Tools YCS H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi function Glue Removal BGA Soldering Adjustable PCB Clamp Features: Larger size, more clamping space, fully applicable to various types of chips motherboards Removal of tin and glue, no need to adjust the direction, travel coaxial movement For iPhone Android full series IC chip, removal of glue tin Not blocking the knife Motherboard cleaning doesn't require
iProGadgets Repair Tools YCS-H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi-function Glue Removal BGA Soldering Adjustable PCB ClampFeatures:
- Larger size, more clamping space, fully applicable to various types of chips/motherboards
- Removal of tin and glue, no need to adjust the direction, travel coaxial movement
- For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
- Motherboard cleaning doesn't require adjusting the orientation, clean up at once
- The module is suitable for various sizes of motherboards in all aspects
1 x Fixture
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy